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ESPResSo 3.2.0-11-g9950804-git
Extensible Simulation Package for Soft Matter Research
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Tcl interface for overlap.h. More...
#include "parser.h"

Go to the source code of this file.
Functions | |
| int | tclcommand_inter_parse_overlapped_bonded (Tcl_Interp *interp, int bond_type, int argc, char **argv) |
| parse parameters for the overlapped bonded potential | |
| int | tclprint_to_result_overlapIA (Tcl_Interp *interp, Bonded_ia_parameters *params) |
Tcl interface for overlap.h.
Definition in file overlap_tcl.h.
| int tclcommand_inter_parse_overlapped_bonded | ( | Tcl_Interp * | interp, |
| int | bond_type, | ||
| int | argc, | ||
| char ** | argv | ||
| ) |
parse parameters for the overlapped bonded potential
Definition at line 32 of file overlap_tcl.c.
References ARG_IS_S, OVERLAP_BOND_ANGLE, OVERLAP_BOND_DIHEDRAL, OVERLAP_BOND_LENGTH, OVERLAP_UNKNOWN, and overlapped_bonded_set_params().
Referenced by tclcommand_inter_parse_bonded().
| int tclprint_to_result_overlapIA | ( | Tcl_Interp * | interp, |
| Bonded_ia_parameters * | params | ||
| ) |
Definition at line 67 of file overlap_tcl.c.
References errexit(), Bonded_ia_parameters::overlap, OVERLAP_BOND_ANGLE, OVERLAP_BOND_DIHEDRAL, OVERLAP_BOND_LENGTH, and Bonded_ia_parameters::p.
Referenced by tclprint_to_result_BondedIA().
1.7.5.1