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ESPResSo 3.2.0-11-g9950804-git
Extensible Simulation Package for Soft Matter Research
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Implementation of angle_tcl.h. More...

Go to the source code of this file.
Functions | |
| int | tclcommand_inter_parse_angle (Tcl_Interp *interp, int bond_type, int argc, char **argv) |
| parse parameters for the angle potential | |
| int | tclprint_to_result_angleIA (Tcl_Interp *interp, Bonded_ia_parameters *params) |
Implementation of angle_tcl.h.
Definition in file angle_tcl.c.
| int tclcommand_inter_parse_angle | ( | Tcl_Interp * | interp, |
| int | bond_type, | ||
| int | argc, | ||
| char ** | argv | ||
| ) |
parse parameters for the angle potential
Definition at line 32 of file angle_tcl.c.
References angle_set_params(), ARG_IS_D, CHECK_VALUE, and PI.
Referenced by tclcommand_inter_parse_bonded().
| int tclprint_to_result_angleIA | ( | Tcl_Interp * | interp, |
| Bonded_ia_parameters * | params | ||
| ) |
Definition at line 62 of file angle_tcl.c.
References Bonded_ia_parameters::angle, and Bonded_ia_parameters::p.
Referenced by tclprint_to_result_BondedIA().
1.7.5.1